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High performance thermal compound with metal and carbon microparticles. This compound does not dry out, harden, or melt, and can withstand temperatures up to 200ºC for a long time.
Gray Thermal Conductivity: 4.8 W/M-K Thermal Impedance: 0.108 ºC-in2/W Specific Density: 2.3 G/Cc 25ºC Evaporation: 0.005% 150ºC/24 hours Constant Dielectric: 5/100Hz Working temperature: -50 to 200ºC COMPOSITION: Metallic oxides: 50% Silicone (PDMS): 40% Carbon Compound: 10% Technical characteristics Application: In CPU and components in general Gray Composition: Silicone (PDMS), metal particles, carbon compound Note: Insoluble in water Product: Thermal bonding paste Size: 7gr Working temperature: Max. -50ºC... +200ºC
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High performance thermal compound with metal and carbon microparticles. This compound does not dry out, harden, or melt, and can withstand temperatures up to 200ºC for a long time.